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Electronic Manufacturing Services (EMS)

Semicon Sp. z o. o. has been providing comprehensive contract manufacturing services for electronic devices (EMS) for three decades. In order to meet the expectations of customers, we care about the highest quality of our services and full technical support: from the design phase, to prototype and serial production, documentation, obtaining approval certificates and production tests. We consider each project individually with highest attention on quality, optimization and environment.

We provide full logistics service, bare PCBs and components sourcing and storage.

We carry out SMT and THT assembly based on the IPC-A-610 “Acceptability of Electronic Assemblies” class 2 and class 3 standards. We have modern devices that enable the assembly of components from 01005 (0.4 mm x 0.2 mm).

We maintain quality by controlling all products on AOI, X-Ray, Flying-Probe, ICT/FCT devices. In addition, we provide PCB washing services, control of ionic purity, application of conformal coatings & potting, PCBA repairs with BGA and others.

As an experienced and innovative company, we offer:

  • PoP technology assembly
  • Flex, Rigid-Flex and Semi-Flex PCBs assembly
  • Flex on Glass, Flex on Board assembly technology
  • Hot Bar technology assembly
  • Long PCB assembly: printing area 915 x 500 mm
  • Full range completion: bare PCBs, components, materials: solder pastes, adhesives, coating materials, thermally conductive materials
  • Laser cutting of SMT stencils, step-up/step-down stencils, stencils on aluminium frames, Vector Guard and self-tension systems
  • Ionic contamination test
  • Conformal coatings services
  • Storage and drying of MSL components
  • AOI and X-Ray control
  • Electrical tests using Flying-Probe device, ICT fixtures
  • Separation of PCBs by mechanical and laser methods (green laser)
  • Press-Fit connectors assembly
  • Wire bonding
  • PCBA repairs, including reballing of BGA and μBGA chips
  • Designs of boards, complete devices and software
  • Commissioning capability, including development and functional testing


Our services for electronics

• Laser cutting of SMT stencils
• Precise details cutting from metal foils
• Wire bonding
• Hot Bar technology assembly
• X-ray inspection and measurement
• PCB cleaning
• Ionic contamination test
• Conformal coating

Profesjonalny montaż płytek elektronicznych, Semicon
układy PoP i płytki elektroniczne, Semicon z Warszawy
Manufacturing Specification:
  • Electronic assembly in lead and lead-free technology
  • Size of the smallest SMD component: 01005 (0.4 mm x 0.2 mm)
  • Minimum SMD component height: 0.2 mm
  • The smallest pitch (fine pitch): 0.2 mm
  • The smallest pitch for BGA type devices: 0.25 mm
  • The smallest ball diameter for BGA type systems: ø 0.1 mm
  • Minimum thickness of rigid PCBs: 0.8 mm (possibility of assembly from 0.1 mm with the use of special base fixtures)
  • Minimum PCB size: (X) 50 mm x (Y) 30 mm (does not apply to PCBs in panels)
  • Maximum PCB size: (X) 800 mm x (Y) 500 mm (possibility of mounting larger sizes upon agreement)
  • ESD protection of components and finished products according to PN-EN IEC 6340 standards
  • Protection of moisture-sensitive components according to the IPC JEDEC JSTD-033 standard

To download:

  1. Conditions for assembly from entrusted parts: link
  2. List of entrusted parts: link

Contact us: 

Inquiries: EMSinquiry@semicon.com.pl
Orders: EMSorder@semicon.com.pl
General information: EMSinfo@semicon.com.pl

Semicon Sp. z o.o.
PL 04-805 Warsaw
Ezopa 71a Street

+48 22 612 67 92
+48 22 825 24 64